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Assembling Process Flowchart
- Before Ass'y
Laser Engraving——Ultrasonic Cleaning
PCBA Cleaning——Sensor Inspection
- PCBA Ass'y (PCBA=PCB)
Printed Circuit Board Assembly
(Ass'y=Assembly)
S Board Check/Clean
S Board Ass'y
P Board Ass'y
P Board(有端口的);S Board(含CMOS板)
上下壳 Ass'y
- Plasma Cleaning
- Dispensing
- AA Adjust Focus(镜头标准,调整 CMOS 的 XY, 倾斜)
AA=Active Alignment
数据传输 I2C
MTF(Modulation Transfer Function)
补偿(CMOS 与 镜头分离)(经过多次测试得到数据)(Oven 后胶水脱水,CMOS 与镜头距离变短,要提前补偿)
半成品对心
半成品脏污
- Oven 85 Degree
- Ass'y FAKRA Ass'y 气密性 Test
- Appearance Inspection
- Test
- 眼宽:
成品对心/MTF Test
震动 Test
脏污测试 USB
电流电压 Test(Mirror)
EVM(Error Vector Magnitude):误差矢量信号平均功率的均方根值与理想信号平均功率的均方根值之比,并以百分比的形式表示。EVM 越小,信号质量越好。
- Packaging
- Moving To Storage
SMT
- NPM(松下贴片机)(普通元件+异性元件)
- 锡膏印刷
- SPI(Solder Paste Inspection):检查锡膏印刷不当
- MES(Manufacturing Execution System)
- 回炉
- AOI